I am a Distinguished Member of Technical Staff & Technical Director at Applied Materials focusing on wafer packaging & integration. I have 12 years of experience in semiconductor process integration, materials supplier management and capital equipment development. Prior to Applied Materials, I held managerial positions at Intel Corporation & UTAC.
South Africa, Australia, China, Hong Kong, India, New Zealand, Singapore, Pakistan, Philippines, Austria, Spain, Germany, Ireland, France, United Kingdom, Netherlands, Switzerland, Caribbean, Mexico, Canada, USA, Israel
|Registration Date||23 January 2015|
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